creat by art - low power loss, high efficiency - guardring for overvoltage protection - high surge current capability - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free base p/n with prefix "h" on packing code - aec-q101 qualified terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test with prefix "h" on packing code meet jesd 201 class 2 whisker test v rrm 20 30 40 50 60 90 100 150 v v rms 14 21 28 35 42 63 70 105 v v dc 20 30 40 50 60 90 100 150 v i f(av) a r jc o c/w t j o c t stg o c document number: ds_d1309017 version: i13 srf1620 thru srf16150 taiwan semiconductor dual common cathode schottk y rectifier features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec ito-220ab mechanical data case: ito-220ab polarity: as marked mounting torque: 5 in-lbs maximum weight: 1.7 g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol srf 1620 srf 1630 srf 1640 srf 1650 srf 1660 srf 1690 srf 16100 srf 16150 unit maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage maximum average forward rectified current 16 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 200 a maximum instantaneous forward voltage (note 1) i f = 8 a v f 0.55 0.70 0.90 1.00 v maximum reverse current @ rated vr t j =25 t j =100 t j =125 i r 0.5 0.1 ma 15 10 - -5 storage temperature range - 55 to +150 note 1: pulse test with pw=300 s, 1% duty cycle typical thermal resistance 2.5 4 operating junction temperature range - 55 to +125 - 55 to +150
part no. part no. srf1660 srf1660 srf1660 (ta=25 unless otherwise noted) document number: ds_d1309017 version: i13 srf1620 thru srf16150 taiwan semiconductor ordering information aec-q101 qualified packing code green compound code package packing srf16xx (note 1) prefix "h" c0 suffix "g" ito-220ab 50 / tube note 1: "xx" defines voltage from 20v (srf1620) to 150v (srf16150) example preferred p/n aec-q101 qualified packing code green compound code description srf1660 c0 c0 srf1660 c0g c0 g green compound srf1660hc0 h c0 aec-q101 qualified ratings and characteristics curves 0 4 8 12 16 20 0 25 50 75 100 125 150 average forward current (a) lead temperature ( o c) fig.1 forward current derating curve srf1660 - 16150 srf1620 - 1650 resistive or inductive load with heatsink 0 50 100 150 200 250 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum non-repetitive forward surge current 0.001 0.01 0.1 1 10 0 20 40 60 80 100 120 140 instantaneous reverse current. (ma) percent of rated peak reverse voltage.(%) fig. 4 typical reverse characteristics tj=25 tj=100 tj=75 0.1 1 10 100 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 instantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics srf1620-1640 srf1650-1660 srf16150 srf1690-16100
min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.16 0.098 0.124 c 2.30 2.96 0.091 0.117 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.95 1.45 0.037 0.057 i 0.50 0.90 0.020 0.035 j 2.40 3.20 0.094 0.126 k 14.80 15.50 0.583 0.610 l - 4.10 - 0.161 m 12.60 13.80 0.496 0.543 n - 1.80 - 0.071 o 2.41 2.67 0.095 0.105 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1309017 version: i13 marking diagram srf1620 thru srf16150 taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 100 1000 10000 0.1 1 10 100 junction capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance srf1620-1640 srf1650-1660 srf1690-16150 f=1.0mhz vslg=50mvp-p 0.1 1 10 100 0.01 0.1 1 10 100 transient thermal impedance ( /w) t-pilse duration(s) fig. 6 typical transient thermal impedance
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1309017 version: i13 srf1620 thru srf16150 taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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